This is my first post and I'm jumping right in.
I'm creating the footprint for the DRV8801PWP in Orcad PCB Editor and could use some help. Hopefully some of the gurus on here use Orcad and PCB Editor!
I'm creating the footprint for the DRV8801PWP in Orcad PCB Editor and could use some help. Hopefully some of the gurus on here use Orcad and PCB Editor!
Right now I'm creating the pad for the powerpad and am a little confused. The specs for the powerpad are on page 23 of the spec sheet: http://www.ti.com/lit/ds/symlink/drv8801.pdf
I'm using Pad Designer to create the pad for a 2 layer board. I'd like the thermal pad to be part of the ground plane. Here is a list of my padstack layers:
Begin Layer Rect 5.00x3.4 (in mm)
Default Internal: Null
End Layer: Rect 5.0x3.4
SolderMask_Top: Square 3.00
SolderMask_Bottom: Null (I don't want a any of the pad on the bottom exposed)
PasteMask_Top: I haven't figured out what this should be yet
Do I have this right?
I also have specified multiple drill in a 2 rows by 2 columns pattern to get the thermal vias. The Drill diameter is 0.33mm per the spec.
I'm using Pad Designer to create the pad for a 2 layer board. I'd like the thermal pad to be part of the ground plane. Here is a list of my padstack layers:
Begin Layer Rect 5.00x3.4 (in mm)
Default Internal: Null
End Layer: Rect 5.0x3.4
SolderMask_Top: Square 3.00
SolderMask_Bottom: Null (I don't want a any of the pad on the bottom exposed)
PasteMask_Top: I haven't figured out what this should be yet
Do I have this right?
I also have specified multiple drill in a 2 rows by 2 columns pattern to get the thermal vias. The Drill diameter is 0.33mm per the spec.
Please let me know if I am doing anything incorrect!
Thanks in advance!